Configuration
主要配置
|
Evaporation Chamber 蒸发腔体 |
304 stainless steel chamber with viewport 蒸发腔体为304不锈钢，并有观察窗 |
|
Vacuum Pumping 真空泵 |
Cryo-pump or Turbo pump and dry rough pump 蒸发室配备分子泵和无油机械泵 |
|
Vacuum Valve 真空阀门 |
Pneumatic UHV gate valves 气动控制超高真空插板阀 |
|
Evaporation Source 蒸发源 |
Multi pocket e-beam source 多坩埚电↘子束蒸发源 |
|
Substrate Chamber 样品室 |
304 stainless steel chamber with viewport 蒸发腔体为304不锈钢，并有观察窗 |
|
Sample Stage 样品台 |
Side mount polar Substrate 侧面安装的转角样品台 |
|
Film Control 膜厚检测 |
Crystal Film thickness Monitor and Control 晶振膜厚监控 |
|
Vacuum Gauging 真空测量 |
Wide range vacuum gauge and rough gauge 宽量程真空计用于测量真空和粗抽计 |
Specification
主要技术╱指标
|
The Base Vacuum Pressure 极限真空∞度 |
better than 9E-9 Torr 优于9E-9托 |
|
Sample Loading Capacity 装样能力 |
One Max. 4 inch flat substrate 一个最大4英寸的平板基片 |
|
Rate Resolution 蒸发速率分辨率 |
0.05 Angstroms/sec |
|
Thickness Resolution = 0.02 Angstroms 膜厚分ζ 辨率 |
0.02 Angstroms
|
Features
特点
Unique Design of Substrate Chamber and Sources chamber isolated by UHV gate valve
独特的结构设计，基片腔体和蒸发源腔体通过UHV门阀隔开
All Metal Seal, True UHV System
系统采用全金属密封，真正的○超高真空系统
Stand along system frameworks and electric rack
独立的系统机架和电器柜
E-beam source Water Interlock
电子束蒸¤发源冷水安全互锁
Optional Substrate Cooling
样品台可选水冷
For R&D Thin Film Deposition
用于薄膜沉积研发
Ideal tools for LIFT-OFF process
用于LIFT-OFF工艺的理想平¤台
Ideal tools for GLAD process
用于GLAD工艺的理想平台
Evaporate metal, Semiconductor or Insulation Materials (material depends)
可蒸发金属，半导体或介质材料（视具体材料而定）
Evaporate Magnetic Materials
可蒸发磁性材料
LOAD LOCK
预真空进样室（可选）
产品技╲术优势：
