DE3000 Multi Chamber Thin Film Deposition System
DE3300 多功能薄膜系统
LOAD LOCK connect sputter and ebeam chamber
LOAD LOCK连接磁控溅射和电子束蒸发腔体
Sputter chamber with front open door
前开门溅射腔体
Multi sputter cathodes
多个磁控溅⌒ 射源
eGun chamber with front open door
前开门电子束蒸发腔体
Multi pocket rotate eGun sources
多坩埚位旋转电子枪
Cryopump and dry pump
冷凝泵和干泵
Max. 6” substrate
最大6”基片
Substrate rotate
基片旋转
Substrate bias (option)
基片偏压（可选）
Substrate heating to 1000C (option)
基片加热1000度(可选)
Up to four process gas
多达四路工艺气体
PID sputter pressure control
PID溅射压力控制
Manual or automatic system control
系统手动或自动控制
Good film uniformity and repeatability
良好的薄膜均匀性和重复性
For sputter metal, semiconductor and insulation materials
可沉积金属、半导体和绝缘材料
For deposition of multi-layer and alloy film
可沉积多层膜及合金薄膜
