DE600 Magnetron Sputtering System
DE600 磁控溅射系统
LOAD LOCK Chamber (option)
LOAD LOCK预真「空进样室(可选)
Chamber with front open door
前开门溅射腔体
Cryopump and dry pump
冷凝泵和干泵
Up to six magnetron sputter cathode
多达6个磁控溅射源
DC, RF or pulse DC power supply
直流、射频或△脉冲电源
Sputter up or down
朝上或朝下溅射
Max. 8” substrate
最大8”基片
Substrate rotation
基片旋转
Substrate bias (option)
基片偏压(可选)
Substrate heating to 1000C (option)
基片加热1000度(可选)
Substrate cooling (option)
基片冷却(可选)
Up to four channel process gas
多达四路工艺气体〖
PID sputter pressure control
PID溅射压力控制
Manual or automatic system control
系统手动或自动控ζ 制
Good film uniformity and repeatability
良好的薄膜均匀性和重复【性
For sputter metal, semiconductor and insulation materials
可沉积金属、半导体和绝缘材料