?Sputter chamber with front open door
?Load Lock
?Up to four 4” cathodes in parallel sputter down
?Sputter distance adjustable under vacuum
?DC, pulse DC or RF sputter
?Up to 4” substrate
?Substrate index, water cooling
?Substrate shutter
?Up to 4 channel gas
?PID pressure control
?Manual or computer control
?Good film uniformity and repeatability
?Sputter metal, semiconductor and insulation
?溅射腔体前开门
?带预真空室
?多达四个四英寸的平行溅射阴极
?溅射距离真空下可调
?DC,脉冲DC或者RF溅射
?四英寸的基→片架
?基片架带索引，水冷
?基片架带挡板
?四个通】道通气
?PID压力控制
?良好的成膜均匀性╱和可重复性
?可溅射金属，半导体和绝缘材料
