?Sputter chamber with front open door
?Load Lock
?Up to five 3” sputter gun in confocal up/down
?DC, pulse DC or RF sputter
?Up to 6” substrate
?Substrate rotating, bias, heating to 1000oC
?Substrate shutter
?Up to 4 channel gas
?PID pressure control
?Manual or computer control
?Good film uniformity and repeatability
?Sputter metal, semiconductor and insulation
?溅射腔体前开门
?带预真空室
?五个三英寸的靶抢上下对焦
?DC，pulse DC or RF sputter
?六英寸的基片架
?基片座可旋转，可偏转，加热可到1K摄氏度
?基片架带挡板
?四通道通气
?PID进行压力控制
?可手动和计算机控制◥
?成膜均匀性和可重复性好
?可溅射金属，半导体和绝缘材料
