DE300 E-beam Evaporation system
DE300 电子束蒸发薄膜沉积真空镀膜系统

LOAD LOCK Chamber (option)
LOAD LOCK预真空进样室（可选）
Chamber with front open door
前开门蒸发腔体
Cryopump and dry pump
冷凝泵和干泵
Multi pocket ebeam sources
多坩埚位旋转电子枪
Max. 6” substrate
最大6”基片
Substrate rotation
基片旋转
Substrate bias (option)
基片偏压（可选）
Ion sources for substrate cleaning (option)
离子源清洗基片（可选）
Substrate heating to 1000C (option)
基片加热1000度(可选)
Crystal rate monitor and film thickness control
晶振沉积◥速率及膜厚控制
Manual or automatic system control
系统手动或自动控制
Good film uniformity and repeatability
良好的薄膜均匀性和重复性
For deposition of metal, semiconductor and insulation materials
可沉积金属、半导体和绝缘材料
For deposition of multi-layer film
可沉积多层膜